Fluid Structure Interaction Numerical Simulation of Wiresweep in Electronics Packaging
Abstract: This paper presents
the computational of two-way fluid structure interaction technique by using Mesh
based Parallel Code Coupling Interface for the visualization of wiresweep in
the electronics packaging. Polymer rheology models with Castro-Macosko model
have been used in the fluid flow model and Volume of Fluid technique was
applied to melt front tracking of the fluid. The numerical analysis used User-Defined
Function to allow curing kinetic model. Wiresweep profiles and pressure
distribution within the mold are presented. The numerical results of melt front
patterns and filled volume were compared with the previous experimental results
and found in good agreement.
Keywords: Fluid Structure
Interaction, MpCCI, Castro-Macosco model, Epoxy Molding Compound, Volume of
Fluid, Wire Sweep
Author: Dadan Ramdan, Usman
Harahap, Andi Rubiantara, Chu Yee Khor
Journal Code: jptkomputergg160172
