Diffusion Bonding Material Tungsten-Baja dengan Interlayer Ag-4% Cu
Abstract: The objective of
this research is to study the implementation diffusion bonding process on
tungsten and low carbon steel system with interlayer Ag-4% Cu, as well as
investigate the influence of process parameters such as temperatur, initial
pressure and heating time to the shear strength of the joint.
Based on the result of shear test, initial pressure 48-144MPa has
positive effect to the shear strength. Likewise by improving temperature of
heating, it will improve the shear strength. The optimal shear strength is
obtained at the temperature 9500C with maximal shear strength is 165 MPa and
its bonding ratio 85%. The temperature 9500C and pressure of 144 MPa diffusion
bonding has been successfully done with the heating time of 15 minute.
Optical and stereomicroscopy on fracture surface after shear testing of
the samples reveal tran granular fracture occur at the interlayer.
Microstructure analysis at the interlayer reveals in variation microstructure
as function of temperature, initial pressure, and heating time. The thickness
of interlayer decrease with increasing the temperature, initial pressure and
heating time. Other wise, the thickness of grain boundary and second phase area
increase with the increasing the temperature, initial pressure and heating time.
Based on the SEM/EDS examination, the element of Fe has the dominant
distribution.
There is accumulation of the element Fe on the limit area with tungsten.
The distribution of the element of W, Ag and Fe increase with the increasing
the heating time. Diffusivity of some atoms has been calculated based on SEM
data at the interlayer. At 9500C, the diffusivity among the element of atom
namely are D Ag to Fe= 0,00195 m2s-1, D Fe to
Ag=0,02364 m2s-1, DAg to W=0,0061 m2s-1 , and DW to Ag= 0,025034 m2s-1.
Penulis: Sirod Hantoro, Tiwan
Kode Jurnal: jptindustridd050027
