Plastic Ball Grid Array Encapsulation Process Simulation on Rheology Effect
Abstract: The integrated
circuit should be encapsulated for protection from their intended environment.
This paper presents the flow visualization of the plastic ball grid array
(PBGA) chip encapsulation process considering of the rheology effect. In the
molding process, encapsulant flow behavior is modeled by Castro-Macosko
viscosity model with considering curing effect and volume of fluid technique is
applied for melt front tracking. The viscosity model is written into C language
and compiled using User-Defined Functions into the FLUENT analysis. Three types
of Epoxy Molding Compound namely case 1, 2, and 3 were utilized for the study
of fluid flow inside the mold cavity. The melt front profiles and viscosity
versus shear rate for all cases are analyzed and presented. The numerical
results are compared with the previous experimental results and found in good
conformity. In the present study, case 1 with greater viscosity shows the
higher air trap and higher pressure distributions.
Author: Dadan Ramdan, Mohd
Zulkifly Abdullah, Khor Chu Yee
Journal Code: jptkomputergg110008
